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Topics
Scaling effects for sub-100nm metal structures: grain growth and microstructureUltra low-k materials, and diffusion processes as well as electrical and mechanical properties of structures with small dimensions (including CPI)
Carbon-based materials and nanostructures (CNT for future interconnects, fullerene-based low-k materials, graphene)
3D integration, TSV and effect on stressed devices
Synchrotron-radiation based techniques (Cu stress, EM/SIV)
Strain/stress measurements and modeling/simulation.
Call for Papers
Late abstracts for poster presentations will be accepted.Address all typewritten abstracts to the Chair: ehrenfried.zschech@izfp-d.fraunhofer.de
Please note, if your abstract is accepted, it will appear in the workshop program booklet as submitted.
The deadline for submission of camera-ready manuscripts for proceedings is May 31, 2010. It is considered crucial to the success of the workshop that all papers be published in a special Proceedings. The American Institute of Physics should again publish the book.
conception and design:
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